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Intel Skylake CPUs Are Warping Under Heat Sink Mounting Pressure

posted by cmn32480 on Saturday December 05 2015, @06:28PM   Printer-friendly
from the same-designer-as-the-iPhone-6 dept.

Nollij writes:

Found this at HotHardware. From the article:

It's been discovered that some third-party heat sinks can physically damage Intel's new Skylake CPUs, along with the pins in the accompanying motherboard socket. The problem has prompted at least one cooler maker to change the design of its Socket 1151 heat sinks and it wouldn't be surprising if others soon followed suit.

The apparent issue is the substrate Intel used for its Skylake chips. A close-up shot of a Skylake CPU sitting side-by-side with a Broadwell processor shows that the substrate is noticeably thinner on Skylake, and thus prone to bending from the force that some third-party heat sinks exert. It also poses a problem for the tiny pins in the socket area of Skylake motherboards.

Sounds like something to be careful of when building that new rig. Has anyone experienced the issue?

takyon:

Update - 3:08PM: This just in from Intel...

"The design specifications and guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations and are available for partners and 3rd party manufacturers. Intel can't comment on 3rd party designs or their adherence to the recommended design specifications. For questions about a specific cooling product we must defer to the manufacturer."

And so it would appear this is an OEM 3rd party manufacturer issue, rather than a generalized issue with the processor(s).

Original Submission

 
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  • (Score: 0) by Anonymous Coward on Saturday December 05 2015, @06:52PM

    by Anonymous Coward on Saturday December 05 2015, @06:52PM (#272233)

    [quote]the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations[/quote]

    So intel is saying there was no change to specs, but their parts are wrapping and breaking.

    So, intel what did you change that makes these new chips out working specs? Worst pat is intel has the cash, to test heat sinks to detemining equality. 3rd party have the incentive to send to Intel to valuate. MY guess is Intel wants all other manufactures to die, so the increase profits again.

  • (Score: 2) by Nollij on Sunday December 06 2015, @06:27AM

    by Nollij (4559) on Sunday December 06 2015, @06:27AM (#272406)

    A lot of heatsinks break specs. I remember looking into this around LGA775. Almost every aftermarket unit on Newegg exceeded the weight limit.

    I bet the same thing is still true.