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posted by martyb on Friday October 13 2017, @11:33AM   Printer-friendly
from the is-that-anything-like-Q*bert? dept.

https://spectrum.ieee.org/tech-talk/computing/hardware/intel-accelerates-its-quantum-computing-efforts-with-17qubit-chip

Intel says it is shipping an experimental quantum computing chip to research partners in The Netherlands today. The company hopes to demonstrate that its packaging and integration skills give it an edge in the race to produce practical quantum computers.

The chip contains 17 superconducting qubits—the quantum computer's fundamental component. According to Jim Clarke, Intel's director of quantum hardware, the company chose 17 qubits because it's the minimum needed to perform surface code error correction, an algorithm thought to be necessary to scaling up quantum computers to useful sizes.

Intel's research partners, at the TU Delft[1] and TNO[2] research center Qutech, will be testing the individual qubits' abilities as well as performing surface code error correction and other algorithms.

[...] For the new quantum chip, Intel adapted so-called flip chip technology to work at millikelvin temperatures. Flip chip involves adding a dot of solder to each bond pad, flipping the chip upside down atop the circuit board, and then melting the solder to bond it. The result is a smaller, denser, and lower inductance connection.

[1] TU Delft: Technische Universiteit Delft aka Delft University of Technology... is the largest and oldest Dutch public technological university, located in Delft, Netherlands. It counts as one of the best universities for engineering and technology worldwide, typically seen within the top 20.It is repeatedly considered the best university of technology in the Netherlands.
[2] TNO: Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek (TNO; English: Netherlands Organisation for Applied Scientific Research) is a nonprofit company in the Netherlands that focuses on applied science.

Also at The Next Platform, Tom's Hardware, and TechCrunch. Intel Newsroom.


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  • (Score: 4, Informative) by bob_super on Friday October 13 2017, @05:34PM (1 child)

    by bob_super (1357) on Friday October 13 2017, @05:34PM (#581883)

    Technically, BGAs can be
      - cavity-up: die facing "up", away from the balls, with gold wirebonds
      - flip-chip: die facing down, with balls on the die attaching to the substrate or the balls of the package

    Flip-chip provides better signal integrity and better thermals, and is also used in multi-chip modules (essentially a small PCB inside the package). Wirebond is cheap.

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  • (Score: 2) by leftover on Saturday October 14 2017, @03:16AM

    by leftover (2448) on Saturday October 14 2017, @03:16AM (#582165)

    Didn't know about "flip-chip-in-package". Mine were bare-neckid on substrate and this was long ago. Thinned silicon too.

    --
    Bent, folded, spindled, and mutilated.