Stories
Slash Boxes
Comments

SoylentNews is people

posted by martyb on Friday October 13 2017, @11:33AM   Printer-friendly
from the is-that-anything-like-Q*bert? dept.

https://spectrum.ieee.org/tech-talk/computing/hardware/intel-accelerates-its-quantum-computing-efforts-with-17qubit-chip

Intel says it is shipping an experimental quantum computing chip to research partners in The Netherlands today. The company hopes to demonstrate that its packaging and integration skills give it an edge in the race to produce practical quantum computers.

The chip contains 17 superconducting qubits—the quantum computer's fundamental component. According to Jim Clarke, Intel's director of quantum hardware, the company chose 17 qubits because it's the minimum needed to perform surface code error correction, an algorithm thought to be necessary to scaling up quantum computers to useful sizes.

Intel's research partners, at the TU Delft[1] and TNO[2] research center Qutech, will be testing the individual qubits' abilities as well as performing surface code error correction and other algorithms.

[...] For the new quantum chip, Intel adapted so-called flip chip technology to work at millikelvin temperatures. Flip chip involves adding a dot of solder to each bond pad, flipping the chip upside down atop the circuit board, and then melting the solder to bond it. The result is a smaller, denser, and lower inductance connection.

[1] TU Delft: Technische Universiteit Delft aka Delft University of Technology... is the largest and oldest Dutch public technological university, located in Delft, Netherlands. It counts as one of the best universities for engineering and technology worldwide, typically seen within the top 20.It is repeatedly considered the best university of technology in the Netherlands.
[2] TNO: Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek (TNO; English: Netherlands Organisation for Applied Scientific Research) is a nonprofit company in the Netherlands that focuses on applied science.

Also at The Next Platform, Tom's Hardware, and TechCrunch. Intel Newsroom.


Original Submission

 
This discussion has been archived. No new comments can be posted.
Display Options Threshold/Breakthrough Mark All as Read Mark All as Unread
The Fine Print: The following comments are owned by whoever posted them. We are not responsible for them in any way.
  • (Score: 0) by Anonymous Coward on Saturday October 14 2017, @05:15PM

    by Anonymous Coward on Saturday October 14 2017, @05:15PM (#582337)

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

    ( https://en.wikipedia.org/wiki/Flip_chip [wikipedia.org] )