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Samsung has quietly added 32 GB unbuffered DDR4 memory modules to its lineup of products. The UDIMMs are based on the company’s 16 Gb chips, which were introduced earlier this year that are already used for 32 GB SO-DIMMs as well as 64 GB RDIMMs.
Samsung’s 32 GB UDIMM is rated to operate at DDR4-2666 date rates at the DDR4 standard voltage of 1.2 V. Samsung does not disclose timings, but since the company sells its own memory modules mainly to large PC OEMs, it is highly likely that the 32 GB UDIMM uses the standard JEDEC latencies for DDR4-2666 (i.e., CL17 17-17 or higher).
[...] modules that use these DRAMs are more energy efficient than DIMMs of the same capacity that rely on a larger number of 8 Gb devices.
[...] Source: Samsung
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Samsung Adds 32 GB UDIMMs to Memory Lineup
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(Score: 1, Interesting) by Anonymous Coward on Thursday September 06 2018, @05:15PM
Many of those boards are limited by power. 32GB of these chips requires approximately 8 Watts of power based on my quick calculations from the specifications. For the machines you cited I calculated how much power these chips (just the chips) would take up of their total power budget and compared it to the current requirements using the same chip (although they are probably using 8Gb chips, so in real life the last column is probably between 1.5x and 2x more). Regardless, there is a chance you'll notice a pattern in the last column for the as-shipped version:
This also doesn't factor in the increased power requirements from other parts of the board to support this much memory on the board. It also doesn't consider the higher amount of cooling required as the TDP is also a bit higher, most likely due to the increased density. There are also other design limits, such as board size and layout, memory address bit depth and a few other things to consider. Suffice to say, anybody could design a system with more memory and power and storage, etc. but engineering is making a useful balance of all the costs and limits inherent in your project and its environment.