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Hiroshima University, National Institute of Information and Communications Technology, and Panasonic Corporation announced the successful development of a terahertz (THz) transceiver that can transmit or receive digital data at 80 gigabits per second (Gbit/s). The transceiver was implemented using silicon CMOS integrated circuit technology, which would have a great advantage for volume production. Details of the technology will be presented at the International Solid-State Circuits Conference (ISSCC) 2019 to be held from February 17 to February 21 in San Francisco, California [1].
The THz band is a new and vast frequency resource expected to be used for future ultrahigh-speed wireless communications. IEEE Standard 802.15.3d, published in October 2017, defines the use of the lower THz frequency range between 252 gigahertz (GHz) and 325 GHz (the "300-GHz band") as high-speed wireless communication channels. The research group has developed a single-chip transceiver that achieves a communication speed of 80 Gbit/s using the channel 66 defined by the Standard. The research group developed a 300-GHz-band transmitter chip capable of 105 Gbit/s [2] and a receiver chip capable of 32 Gbit/s [3] in the past few years. The group has now integrated a transmitter and a receiver into a single transceiver chip.
"We presented a CMOS transmitter that could do 105 Gbit/s in 2017, but the performance of receivers we developed, or anybody else did for that matter, were way behind [3] for a reason. We can use a technique called 'power combining' in transmitters for performance boosting, but the same technique cannot be applied to receivers. An ultrafast transmitter is useless unless an equally fast receiver is available. We have finally managed to bring the CMOS receiver performance close to 100 Gbit/s," said Prof. Minoru Fujishima, Graduate School of Advanced Sciences of Matter, Hiroshima University.
(Score: 2) by HiThere on Saturday February 23 2019, @05:29PM
That's a good argument for a grounded chassis, but it's not an argument for an internal bus. And you'd need lots of power supplies if you didn't plug the chips into a motherboard. But imagine using it as an approach to constructing true 3D (or even n-dimensional) systems. Some of the signal would probably leak, but it's information content would probably be degraded until it was worse than trying to read minds by looking at EEGs. And radio connections allows you to get away from the heat sink problem that 3-D systems have always had.
All that said, the radio links are inherently going to be slower than direct wired connections unless the wires are pretty long. Because they've got a few extra conversion steps. So if wired connections are feasible, they'll be preferred.
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