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takyon writes:

DARPA 3DSoC CNFET project moves towards commercialisation phase

Skywater, the US government trusted fab partner, and MIT have announced that the DARPA Three Dimensional Monolithic System-on-a-Chip (3DSoC) programme, has entered its second phase.

After completing the program's initial phase, focused on transferring the Carbon Nanotube Field Effect Transistor (CNFET)-based 3DSoC technology into SkyWater's 200 mm production facility, phase two will focus on refining manufacturing quality, yield, performance, and density – key elements of commercial viability.

[...] A 3DSoC program update will be presented by MIT professor, Dr. Max Shulaker at the virtual 2020 DARPA Electronics Resurgence Initiative (ERI) Summit on August 20th.

Arm Announces Three Year Partnership With DARPA Aimed At Maintaining U.S. Chip Design Lead

In a development that falls in line with recent U.S. efforts to bring semiconductor manufacturing inside its shores, British chip design house Arm announced yesterday that it has entered into a three-year partnership agreement with the Defence Advanced Research Projects Agency (DARPA). The announcement came as the agency wrapped off an event related to its Electronic Resurgence Initiative (ERI), which is focused on reducing reliance on internationally fabricated semiconductors.

Under the partnership, all of Arm's commercial chip design architectures and intellectual property will be available for use on DARPA projects. The duo will also collaborate on efforts such as sensors that rely on low power use for constant monitoring. At the ERI Summit yesterday, Arm's chief executive officer Simon Segars focused his discussion on devices that fall under the ambit of the Internet of Things (IoT), and the connection of these devices with next-generation 5G networks.

Previously: DARPA's 3DSoC Becoming a Reality

Related: Washington in Talks with Chipmakers about Building U.S. Factories

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