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takyon [soylentnews.org] writes:

Samsung's plans to make 256 GB memory modules [anandtech.com] using 16 Gb chips are moving forward:

Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung's 16 Gb DDR4 memory devices introduced earlier this year and takes advantage of the company's 3DS (three-dimensional stacking) packaging. The new module will offer higher performance and lower power consumption than two 128 GB LRDIMMs used today.

Samsung's 256 GB DDR4 Registered DIMM with ECC carries 36 memory packages featuring 8 GB (64 Gbit) of capacity each, along with IDT's 4RCD0229K register chip (to buffer address and command signals and increase the number of ranks supported by a memory channel). The packages are based on four single-die 16 Gb components that are interconnected using through-silicon vias (TSVs). Architecturally, the 256 GB module is octal ranked as it features two physical ranks and four logical ranks.

1 TB can't be too far behind.

Previously: Samsung Mass Produces 128 GB DDR4 Server Memory [soylentnews.org]
Samsung Shows Off New 64 GB Server Memory Modules Using 16 Gb Chips, Promises 128-256 GB This Year [soylentnews.org]
Samsung Unveils 32 GB Laptop DDR4 Modules [soylentnews.org]

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