Samsung Announces 8 GB DRAM Package for Mobile Devices

Samsung Announces 12Gb LPDDR4 DRAM, Could Enable Smartphones With 6 GB of RAM 24 comments

Samsung has announced the mass production of 12 Gb (1.5 GB) LPDDR4 DRAM chips on a 20nm process. The state-of-the-art was previously 8 Gb. The new DRAM chips could enable the production of smartphones with 6 gigabytes of RAM:

The production of 12Gb chips opens up the possibility of smartphones and tablets with 6GB of RAM using a four 12Gb chip DRAM package, as well as 3GB using just two chips in a package. A 6GB package would also only take up the same amount of space as existing 3GB packages which use 6Gb chips. The new 12Gb chips also end up being very slightly more than 30% faster than their 8Gb chips, with a per-pin speed of 4266Mbps which would give 34Gbps of bandwidth over a 64bit bus. With Samsung beginning mass production of this new memory it's only a matter of time before we start to see more devices move from 2GB to 3GB and from 4GB to 6GB of RAM.

There are several phones on the market with 4 GB of RAM, such as the Oppo Find 9, Xiaomi Mi Note Pro, ASUS ZenFone 2, Sony Xperia Z4, Lenovo K80, Huawei Ascend D8, and soon, Micromax's YU5050. These manufacturers could use 12 Gb chips to create phones with 6 GB of faster RAM without using additional chips.

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Samsung Announces "10nm-Class" 8 Gb DRAM Chips 10 comments

takyon writes:

Samsung Electronics has announced the production of "10nm-class" 8 gigabit DRAM chips that will be used in DDR4 modules with capacities ranging from 4 GB to 128 GB. "10nm-class" is an industry term that refers to an unspecified process somewhere between 10 nanometers and 19 nanometers.

In November, Samsung announced the production of 128 GB DDR4 registered dual inline memory modules (RDIMMs) using through silicon via (TSV) stacked dies with four 8 gigabit chips per package. Those modules used 20nm process DRAM and achieved a 2,400 Mbps data rate. The new 10nm-class memory will support a 3,200 Mbps data rate.

Original Submission

Oppo Likely to Release the First Smartphone With 10 GB of RAM 34 comments

takyon writes:

OPPO Find X to get 10GB RAM version, spotted at TENAA

There have been rumors of a 10GB RAM smartphone in development for a while now. Vivo's yet unreleased Xplay7 was rumored to come with 10GB RAM and the ASUS ROG Phone was also supposed to come with 10GB of RAM. It appears OPPO will be the first to launch a 10GB RAM phone judging by an updated TENAA listing of the Find X.
The Find X originally comes with 8GB of RAM and 128GB or 256GB of storage but Chinese leaker @UniverseIce shared a photo of an updated listing that shows the Find X will get a new 10GB RAM + 256GB ROM model.
We were able to confirm that the leak is genuine as the full TENAA specs listing for the Find X (PAFM00 model) now has a 10GB RAM variant. The update to the listing was made yesterday. The rest of the specs will remain the same as the other variant.

TENAA is China's phone regulatory body.

Also at The Verge, Engadget, Fossbytes, and BGR.

Original Submission

Samsung Announces Mass Production of 16 GB LPDDR5 DRAM Packages 9 comments

takyon writes:

Samsung Starts Mass Production of Second-Gen 16GB LPDDR5 RAM for Future Premium Smartphones

Samsung has announced that it will kick off mass production of the world's first 16GB LPDDR5 RAM package for future smartphones. Last year, the Korean giant stated that it started mass production of 12GB LPDDR5 RAM. For 2020, Samsung has taken that production dial to the next phase and claims that the new RAM packages will enable users to experience enhanced 5G and AI features ranging from graphic-rich gaming and smart photography.
According to the company, the data transfer rate for the 16GB LPDDR5 [package] is 5500Mb/s (megabits per second), making it significantly faster than the previous-generation LPDRR4X RAM package, which peaks out at 4266Mb/s. That's not the only benefit of using these chips, because compared to an 8GB LPDDR4X package, the new mobile DRAM can deliver more than 20 percent power savings while offering twice the memory capacity.

16 GB DRAM packages could also be used in single board computers and other compact systems. For example, the BCM2711 SoC used in the Raspberry Pi 4 Model B can theoretically address up to 16 GB of memory.

Samsung press release. Also at AnandTech.

Previously: Samsung Announces 8 GB DRAM Package for Mobile Devices
Samsung Announces LPDDR5 DRAM Prototype Before Specification is Finalized
Samsung Begins Mass Producing 12 GB DRAM Packages for Smartphones
Samsung Mass Producing LPDDR5 DRAM (12 Gb x 8 for 12 GB Packages)
Get Ready for Smartphones with 16 GB of RAM

Original Submission

Samsung's Second Generation 10nm-Class DRAM in Production 1 comment

takyon writes:

Samsung's second generation ("1y-nm") 8 Gb DDR4 DRAM dies are being mass produced:

Samsung late on Wednesday said that it had initiated mass production of DDR4 memory chips using its second generation '10 nm-class' fabrication process. The new manufacturing technology shrinks die size of the new DRAM chips and improves their performance as well as energy efficiency. To do that, the process uses new circuit designs featuring air spacers (for the first time in DRAM industry). The new DRAM ICs (integrated circuits) can operate at 3600 Mbit/s per pin data rate (DDR4-3600) at standard DDR4 voltages and have been validated with major CPU manufacturers already.
[...] Samsung's new DDR4 chip produced using the company's 1y nm fabrication process has an 8-gigabit capacity and supports 3600 MT/s data transfer rate at 1.2 V. The new D-die DRAM runs 12.5% faster than its direct predecessor (known as Samsung C-die, rated for 3200 MT/s) and is claimed to be up to 15% more energy efficient as well. In addition, the latest 8Gb DDR4 ICs use a new in-cell data sensing system that offers a more accurate determination of the data stored in each cell and which helps to increase the level of integration (i.e., make cells smaller) and therefore shrink die size.
Samsung says that the new 8Gb DDR4 chips feature an "approximate 30% productivity gain" when compared to similar chips made using the 1x nm manufacturing tech.
UPDATE 12/21: Samsung clarified that productivity gain means increase in the number of chips per wafer. Since capacity of Samsung's C-die and D-die is the same, the increase in the number of dies equals the increase in the number of bits per wafer. Therefore, the key takeaway from the announcement is that the 1y nm technology and the new in-cell data sensing system enable Samsung to shrink die size and fit more DRAM dies on a single 300-mm wafer. Meanwhile, the overall 30% productivity gain results in lower per-die costs at the same yield and cycle time (this does not mean that the IC costs are 30% lower though) and increases DRAM bit output.

The in-cell data sensing system and air spacers will be used by Samsung in other upcoming types of DRAM, including DDR5, LPDDR5, High Bandwidth Memory 3.0, and GDDR6.

Also at Tom's Hardware.

Previously: Samsung Announces "10nm-Class" 8 Gb DRAM Chips

Original Submission

Samsung Begins Mass Producing 12 GB DRAM Packages for Smartphones 9 comments

takyon writes:

Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones

Samsung announced late on Wednesday that it had started volume production of 12 GB LPDDR4X-4266 memory for high-end smartphones. The chip is currently the highest-density DRAM for mobile applications. The first smartphone to use Samsung's 12 GB LPDDR4X DRAM package will be the company's own Galaxy S10+ handset formally announced last month.
Samsung's 12 GB LPDDR4X package integrates six 16 Gb memory devices featuring a 4266 MT/s data transfer rate at 1.1 Volts and produced using the company's second-generation '10nm-class' process technology (also known as 1y-nm). The 12 GB memory module is 1.1 mm tall, which is a bit higher than standard quad-die LPDDR4X packages (which are thinner than 1 mm), but Samsung has managed to incorporate the device into its latest premium smartphone.

Were the previously announced 12 GB DRAM smartphones using two packages instead of this one thick package?

Original Submission

SK Hynix Announces 8 GB LPDDR4x DRAM Package for Mobile Devices 2 comments

takyon writes:

Back in October, we reported that Samsung announced an 8 GB LPDDR4-4266 DRAM package for smartphones and other mobile devices. Now, SK Hynix has announced an 8 GB LPDDR4x-4266 DRAM package for smartphones. LPDDR4x is a proposed variant to LPDDR4 that is identical, except that the I/O voltage is reduced from 1.1 V to 0.6 V. It is expected to cut the power consumption of the DRAM sub-system by 18-20% (compared to 8 GB LPDDR4-4266).

Oddly enough, Samsung proposed the LPDDR4x variant yet it looks like SK Hynix will beat them to the market:

The first application processor to support the new type of memory is MediaTek's Helio P20 that was announced nearly a year ago and the initial devices powered by the chip are likely to hit the market in 1H 2017. Another notable SoC to support LPDDR4X is Qualcomm's new flagship Snapdragon 835, which was announced in November and detailed earlier this month. Smartphones featuring this chip will not show up for a while, but MWC [(Mobile World Congress) is] just around the corner which lends nicely to various handset announcements.
The 8 GB (64 Gb) LPDDR4X package stacks four 16 Gb DRAM parts that feature a 4266 MT/s data transfer rate and provide up to 34.1 GB/s of bandwidth when connected to an application processor using a 64-bit memory bus. For its 8 GB LPDDR4X solution SK Hynix uses a new 12 mm × 12.7 mm BGA package, which is 30% smaller compared to standard LPDDR4 stacks that come in 15 mm × 15 mm form-factor. SK Hynix's 8 GB LPDDR4X solution has a thickness of less than 1 mm to enable PoP stacking with a mobile application processor or a UFS NAND storage device.

The lineup will eventually be expanded to include packages with less than 8 GB of memory and lower data rates such as 3733 MT/s.

Original Submission

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