from the AMD-Inside™ dept.
the new processor integrates a "semi-custom" AMD graphics chip and the second generation of Intel's "High Bandwidth Memory (HBM2)", which is comparable to GDDR5 in a traditional laptop.
Intel CPU and AMD GPU, together at last
Summary of Intel's news:
The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD's Radeon Technologies Group* – all in a single processor package.
[...] At the heart of this new design is EMIB (Embedded Multi-Die Interconnect Bridge), a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.
[...] Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.
takyon: This is more like an "integrated discrete GPU" than standard integrated graphics. It also avoids the need for Intel to license AMD's IP. AMD also needs to make a lot of parts since its wafer supply agreement with GlobalFoundries penalizes AMD if they buy less than a target number of wafers each year.
Shares of AMD rose 11.6% on Tuesday as Fudzilla reported that Intel would license graphics technologies from AMD after a similar deal with Nvidia expired two months earlier. The deal has not been confirmed.
On the other hand, AMD's 16-core "Threadripper" enthusiast/HEDT CPUs have been confirmed:
With one of the gnarliest CPU codenames we've ever seen, the Threadripper multicore monsters will go head to head with Intel's Broadwell-E and upcoming Skylake-E High-End Desktop (HEDT) CPUs alongside a new motherboard platform that promises expanded memory support and I/O bandwidth. That's likely to take the form of quad-channel RAM and more PCIe lanes, similar to Intel's X99 platform, but AMD is saving further details for its press conference at Computex at the end of May.
AMD's 32-core "Naples" server chips are now known as... "Epyc".
You have seen the launch of 4, 6, and 8-core AMD Ryzen parts. How do you feel about 10, 12, 14, and 16 cores (prices unknown, likely $1,000 or more for 16 cores)?
In response to increased demand, Samsung is increasing production of the densest HBM2 DRAM available:
Samsung on Tuesday announced that it is increasing production volumes of its 8 GB, 8-Hi HBM2 DRAM stacks due to growing demand. In the coming months the company's 8 GB HBM2 chips will be used for several applications, including those for consumers, professionals, AI, as well as for parallel computing. Meanwhile, AMD's Radeon Vega graphics cards for professionals and gamers will likely be the largest consumers of HBM2 in terms of volume. And while AMD is traditionally a SK Hynix customer, the timing of this announcement with AMD's launches certainly suggests that AMD is likely a Samsung customer this round as well.
Samsung's 8 GB HBM Gen 2 memory KGSDs (known good stacked die) are based on eight 8-Gb DRAM devices in an 8-Hi stack configuration. The memory components are interconnected using TSVs and feature over 5,000 TSV interconnects each. Every KGSD has a 1024-bit bus and offers up to 2 Gbps data rate per pin, thus providing up to 256 GB/s of memory bandwidth per single 8-Hi stack. The company did not disclose power consumption and heat dissipation of its HBM memory components, but we have reached out [to] Samsung for additional details.
Remember when we reported on the Radeon Technologies Group boss, Raja Koduri, taking a leave of absence with an intent to return to the fold in December? That isn't going to happen, according to a memo Raja has written to his team, because today is his last day in the job.
[...] Our sources tell us that Lisa Su, AMD CEO, will continue to oversee RTG for the foreseeable future. AMD appreciates that such an important role cannot be the sole domain of the CEO, and to this end is actively searching for a successor to Raja. We expect the appointment to be made within a few months.
The rumor mill suggests that Koduri will take a job at Intel, which would come at an interesting time now that Intel is including AMD graphics and High Bandwidth Memory in some of its products.
On Monday, Intel announced that it had penned a deal with AMD to have the latter provide a discrete GPU to be integrated onto a future Intel SoC. On Tuesday, AMD announced that their chief GPU architect, Raja Koduri, was leaving the company. Now today the saga continues, as Intel is announcing that they have hired Raja Koduri to serve as their own GPU chief architect. And Raja's task will not be a small one; with his hire, Intel will be developing their own high-end discrete GPUs.
[...] [In] perhaps the only news that can outshine the fact that Raja Koduri is joining Intel, is what he will be doing for Intel. As part of today's revelation, Intel has announced that they are instituting a new top-to-bottom GPU strategy. At the bottom, the company wants to extend their existing iGPU market into new classes of edge devices, and while Intel doesn't go into much more detail than this, the fact that they use the term "edge" strongly implies that we're talking about IoT-class devices, where edge goes hand-in-hand with neural network inference. This is a field Intel already plays in to some extent with their Atom processors on the GPU side, and their Movidius neural compute engines on the dedicated silicon sign.
However in what's likely the most exciting part of this news for PC enthusiasts and the tech industry as a whole, is that in aiming at the top of the market, Intel will once again be going back into developing discrete GPUs. The company has tried this route twice before; once in the early days with the i740 in the late 90s, and again with the aborted Larrabee project in the late 2000s. However even though these efforts never panned out quite like Intel has hoped, the company has continued to develop their GPU architecture and GPU-like devices, the latter embodying the massive parallel compute focused Xeon Phi family.
Yet while Intel has GPU-like products for certain markets, the company doesn't have a proper GPU solution once you get beyond their existing GT4-class iGPUs, which are, roughly speaking, on par with $150 or so discrete GPUs. Which is to say that Intel doesn't have access to the midrange market or above with their iGPUs. With the hiring of Raja and Intel's new direction, the company is going to be expanding into full discrete GPUs for what the company calls "a broad range of computing segments."
An Intel website leaked some details of the Intel Core i7-8809G, a "Kaby Lake" desktop CPU with on-package AMD Radeon graphics and High Bandwidth Memory 2.0. While it is listed as an 8th-generation part, 8th-generation "Coffee Lake" CPUs for desktop users have up to 6 cores (in other words, Intel has been releasing multiple microarchitectures as "8th-generation"). The i7-8809G may be officially announced at the Consumer Electronics Show next week.
The components are linked together using what Intel calls "embedded multi-die interconnect bridge technology" (EMIB). The thermal design power (TDP) of the entire package is around 100 Watts:
Intel at the original launch did state that they were using Core-H grade CPUs for the Intel with Radeon Graphics products, which would mean that the CPU portion is around 45W. This would lead to ~55W left for graphics, which would be in the RX 550 level: 8 CUs, 512 SPs, running at 1100 MHz. It is worth nothing that AMD already puts up to 10 Vega CUs in its 15W processors, so with the Intel i7-8809G product Intel has likely has gone wider and slower: judging by the size of the silicon in the mockup, this could be more of a 20-24 CU design built within that 55W-75W window, depending on how the power budget is moved around between CPU and GPU. We await more information, of course.
It is rumored to include 4 GB of HBM2 on-package, while the CPU also supports DDR4-2400 memory. Two cheaper EMIB CPUs have been mentioned:
According to some other media, the 8809G will turbo to 4.1 GHz, while the graphics will feature 24 [compute units (CUs)] (1536 [stream processors (SPs)]) running at 1190 MHz while the HBM2 is 4GB and will run at 800 MHz. The same media are also listing the Core i7-8705G (20 CUs, 1000 MHz on 'Vega M GL', 700 MHz on HBM2) and a Core i7-8706G. None of the information from those sources is yet to be verified by AnandTech or found on an official Intel webpage.
Currently available AMD Ryzen Mobile APUs only include 8-10 Vega CUs. These are mobile chips with a maximum TDP of 25 W; no desktop Ryzen chips with integrated graphics have been announced yet.