from the when-the-lights-are-on dept.
At the Consumer Electronics Show, AMD confirmed details about products coming out in 2018:
- Ryzen 3 Mobile APUs: January 9th
- Ryzen Desktop APUs: February 12th
- Second Generation Ryzen Desktop Processors: April.
- Ryzen Pro Mobile APUs: Q2 2018
- Second Generation Threadripper Processors: 2H 2018
- Second Generation Ryzen Pro Desktop Processors: 2H 2018
The second generation "Zen+" products use a "12nm" process. Zen 2 and Zen 3 will use a "7nm" and "7nm+" process and will be out around 2019-2020.
Two cheaper Ryzen-based mobile APUs have been released. The Ryzen 3 2300U has 4 cores, 4 threads, and the Ryzen 3 2200U has 2 cores, 4 threads, making it the first dual-core part in the entire Ryzen product line. All of the Ryzen mobile parts have a 15 W TDP so far.
AMD has also lowered the suggested pricing for many of its Ryzen CPUs. For example, $299 for Ryzen 7 1700 from $329. The Threadripper Ryzen TR 1900X is down to $449 from $549.
Intel has officially launched five new Kaby Lake CPUs with AMD Radeon Vega graphics and 4 GB of High Bandwidth Memory. Each CPU also includes Intel's HD 630 GT2 integrated graphics, which is expected to be used for lower power video encode/decode tasks.
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AMD's high Ryzen sales may have convinced the company to release a new version on a slightly improved process in Spring 2018:
AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries, according to sources at motherboard makers.
The company will initially release the CPUs codenamed Pinnacle 7, followed by mid-range Pinnacle 5 and entry-level Pinnacle 3 processors in March 2018, the sources disclosed. AMD is also expected to see its share of the desktop CPU market return to 30% in the first half of 2018.
AMD will launch the low-power version of Pinnacle processors in April 2018 and the enterprise version Pinnacle Pro in May 2018.
The new "Pinnacle Ridge" chips appear to be part of a Zen 1 refresh rather than "Zen 2", which is expected to ship in 2019 on a 7nm process. The 12nm Leading-Performance (12LP) process was described by GlobalFoundries as providing 15% greater circuit density and a 10% performance increase compared to its 14nm FinFET process.
AMD has yet to release 14nm "Raven Ridge" CPUs for laptops.
These are 15 W TDP chips intended for lower-power but high performance designs (e.g. "Ultrabooks"). Chips with higher TDPs will come out later. In comparing the Ryzen 7 2700U to the AMD FX-9800P, an Excavator-based 15 W TDP chip that was released in 2015, AMD claims that CPU performance has been increased by 200% while GPU performance has increased by 128%. The 200% figure is a result of doubling the core/thread count (the Excavator chip used 2 "modules" rather than 4 real cores) and Ryzen's approximate 52% increase in instructions per clock:
An Intel website leaked some details of the Intel Core i7-8809G, a "Kaby Lake" desktop CPU with on-package AMD Radeon graphics and High Bandwidth Memory 2.0. While it is listed as an 8th-generation part, 8th-generation "Coffee Lake" CPUs for desktop users have up to 6 cores (in other words, Intel has been releasing multiple microarchitectures as "8th-generation"). The i7-8809G may be officially announced at the Consumer Electronics Show next week.
The components are linked together using what Intel calls "embedded multi-die interconnect bridge technology" (EMIB). The thermal design power (TDP) of the entire package is around 100 Watts:
Intel at the original launch did state that they were using Core-H grade CPUs for the Intel with Radeon Graphics products, which would mean that the CPU portion is around 45W. This would lead to ~55W left for graphics, which would be in the RX 550 level: 8 CUs, 512 SPs, running at 1100 MHz. It is worth nothing that AMD already puts up to 10 Vega CUs in its 15W processors, so with the Intel i7-8809G product Intel has likely has gone wider and slower: judging by the size of the silicon in the mockup, this could be more of a 20-24 CU design built within that 55W-75W window, depending on how the power budget is moved around between CPU and GPU. We await more information, of course.
It is rumored to include 4 GB of HBM2 on-package, while the CPU also supports DDR4-2400 memory. Two cheaper EMIB CPUs have been mentioned:
According to some other media, the 8809G will turbo to 4.1 GHz, while the graphics will feature 24 [compute units (CUs)] (1536 [stream processors (SPs)]) running at 1190 MHz while the HBM2 is 4GB and will run at 800 MHz. The same media are also listing the Core i7-8705G (20 CUs, 1000 MHz on 'Vega M GL', 700 MHz on HBM2) and a Core i7-8706G. None of the information from those sources is yet to be verified by AnandTech or found on an official Intel webpage.
Currently available AMD Ryzen Mobile APUs only include 8-10 Vega CUs. These are mobile chips with a maximum TDP of 25 W; no desktop Ryzen chips with integrated graphics have been announced yet.