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posted by CoolHand on Saturday March 18 2017, @02:15AM   Printer-friendly
from the bigger-is-not-always-better dept.

Samsung has shipped 70,000 silicon wafers worth of "10nm Low Power Early" chips, and is planning a supposed 6 nanometer process. The company implies that it will make 8nm and 6nm chips in addition to 10nm and 7nm:

It's looking like Samsung will be the first company to manufacture 10nm chips, besting both Intel and TSMC. Samsung has also already set its eyes on the 8nm, 7nm, and 6nm process technologies. The 8nm and 6nm processes will likely be follow-up technologies to the 10nm and 7nm processes, respectively.

The company is expected to reach 7nm by 2019, a move that could be enabled by its partnership with IBM. The company may also use EUV lithography for its 7nm process, but it's not yet clear whether EUV lithography will be available for the first ever 7nm process iteration. Intel has hinted before that it may not adopt EUV lithography until the 5nm process generation. Samsung will reveal more details about its roadmap, including the 8nm and 6nm process generations, at the upcoming U.S Samsung Foundry Forum scheduled for May 24, 2017.

Samsung press release.


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  • (Score: 3, Informative) by richtopia on Saturday March 18 2017, @07:29PM

    by richtopia (3160) on Saturday March 18 2017, @07:29PM (#480898) Homepage Journal

    Unfortunately there isn't really an industry standard as to what node size is, particularly as we move to more and more 3d structures.

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