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posted by martyb on Thursday June 08 2017, @07:39PM   Printer-friendly
from the thanks-for-the-memories dept.

SK Hynix is currently developing 96-layer and 128-layer 3D NAND with 3 bits per cell, but may be skipping quad-level cell 3D NAND for some time:

The 64-layer 3D NAND about to land from Micron and Toshiba certainly sounds impressive, but it pales in comparison to what Sk Hynix is working on for future release. The company is developing 96-layer and 128-layer 3D NAND flash. The new flash won't be available for a few years, but that makes it no less exciting. We have yet to see 72-layer 3D from Sk Hynix in our lab, but it will begin shipping soon in the PC401 using 256Gbit TLC die, according to the UNH-IOL list of tested products.

The information we found about the successor to 256Gbit 72-layer 3D TLC shows 96 layers with 512Gbit die capacity. The follow up to that is a massive 1Tbit die from 128-layer TLC from the other South Korean SSD manufacturer with full vertical integration.

Toshiba (or whichever company acquires Toshiba's memory division) may be more likely to introduce QLC 3D NAND.

Previously:
SK Hynix Plans 72-Layer 512 Gb NAND for Late 2017
64-Layer 3D NAND at Computex


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  • (Score: 2) by Snotnose on Thursday June 08 2017, @11:29PM

    by Snotnose (1623) on Thursday June 08 2017, @11:29PM (#522842)

    My understanding is that 3D NAND die height does not differ that much from 2D yet. Keep in mind that multiple dies are stacked together to make a package [theregister.co.uk], just like with 2D.

    This is what I'm asking. 15 years ago Qualcomm made chips with the baseband chip, RF chip (I think, memory is fuzzy), and memory stacked on top of each other in a single package (SC2x I think they called it). The resulting chips were noticeably thicker, maybe twice as thick. That's what got me thinking. Basically, if height = 1/16" * layers / 2, then if layers is 100 we're looking at 50/16" or a 3.5 inch thick chip. Which I don't see working, mostly due to how to you get rid of the heat from the core?

    / Qualcomm's idea was you bought a chip, added a battery, keyboard, display, speaker, mic, usb port and package
    // Sell the chip for $6.25 if memory serves
    /// Chips go into phones destined for 3rd world countries for maybe $15

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