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posted by Fnord666 on Wednesday December 19 2018, @10:58PM   Printer-friendly
from the like-pancakes dept.

JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard.

[...] JEDEC standard JESD235B for HBM leverages Wide I/O and TSV technologies to support densities up to 24 GB per device at speeds up to 307 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard can support 2-high, 4-high, 8-high, and 12-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB – 24 GB per stack.

This update extends the per pin bandwidth to 2.4 Gbps, adds a new footprint option to accommodate the 16 Gb-layer and 12-high configurations for higher density components, and updates the MISR polynomial options for these new configurations.

Some existing High Bandwidth Memory products already had a per pin bandwidth of 2.4 Gbps. However, the increase in stack size and density could allow a product with 96 GB of DRAM using just four stacks (16 Gb DRAM × 12 × 4), up from 32 GB (8 Gb DRAM × 8 × 4).

This update apparently applies to HBM2 and is not considered a third or fourth generation of HBM.

Also at Wccftech and AnandTech.

Previously: Samsung Increases Production of 8 GB High Bandwidth Memory 2.0 Stacks


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  • (Score: 2) by takyon on Thursday December 20 2018, @03:35AM

    by takyon (881) <{takyon} {at} {soylentnews.org}> on Thursday December 20 2018, @03:35AM (#776653) Journal

    Did I not clickbait enough?

    Anyway, AnandTech came out with their story so let's see what they have to say:

    On the capacity front, the new version of the specification, JESD235B, had added support for 12-Hi chip stacks. With 4 more layers than the previous limit of 8-Hi stacks, this will allow memory manufacturers to produce 12 GB stacks at current densities, and 24 GB stacks in the future when 16 Gb layers become available. Though it's worth noting that while 12-Hi stacks are now part of the HBM specification, the group still lists the physical dimensions of a 12-Hi KGSD (known good stacked die) as "TBD", so it's not immediately clear right now whether 12-Hi stacks will follow the same 720μm typical/745μm maximum stack height rules as the current 2/4/8-Hi configurations. Otherwise the configuration of the stacks themselves are unchanged; the new KGSDs will continue to feature up to eight 128-bit channels as well as a 1024-bit physical interface.

    [...] All told, the updated specification means that a fully built-out 4096-bit HBM memory subsystem following the JESD235B spec can now contain 96 GB of memory with a peak bandwidth of 1.228 TB/s.

    Mr. Shilov goes on to speculate that JEDEC wouldn't have published this update unless a manufacturer (Samsung, SK Hynix, etc.) wasn't already working on 12-Hi stacks.

    It would be nice to see HBM added to more APUs and SoCs (which pretty much all CPUs are nowadays). Expensive, sure, but it could be worth the investment. And it's great to see progress in vertical technologies like this one. Just how high can they stack it?

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  • (Score: 0) by Anonymous Coward on Thursday December 20 2018, @03:37AM (1 child)

    by Anonymous Coward on Thursday December 20 2018, @03:37AM (#776654)

    I have HBM1. How do I become more envious? Most people are not envious and want to become more envious.

    • (Score: 3, Funny) by takyon on Thursday December 20 2018, @03:47AM

      by takyon (881) <{takyon} {at} {soylentnews.org}> on Thursday December 20 2018, @03:47AM (#776661) Journal

      How do I become more envious?

      1. Go to YouTube.
      2. Search "RTX 2080 Ti". Wait a second, they put GDDR6 on it.
      3. Search Google Duck.com for "HBM Nvidia".
      4. Go back to GooTube and search for "Titan RTX".
      5. Wait for AMD Navi.

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