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Arthur T Knackerbracket has found the following story:

Getting rid of heat is one of the central challenges with modern technology. It doesn’t matter whether the technology is a high-end server CPU or some pathetically anemic processor in a no-brand set-top box, someone has had to think about thermal management. One of the central issues in thermal management is thermal resistance, a material's tendency to limit the flow of heat. The thicker a material, the larger the temperature gradient required to achieve the same amount of cooling because the thermal resistance increases with thickness.

Except when it doesn’t; if the heat is carried by ballistic phonons, then thermal resistance stays constant.

Original Submission