SoylentNews is people
SoylentNews
The Trillion-Transistor Chip That Just Left a Supercomputer in the Dust:
So, in a recent trial, researchers pitted the chip—which is housed in an all-in-one system about the size of a dorm room mini-fridge called the CS-1—against a supercomputer in a fluid dynamics simulation. Simulating the movement of fluids is a common supercomputer application useful for solving complex problems like weather forecasting and airplane wing design.
The trial was described in a preprint paper written by a team led by Cerebras's Michael James and NETL's Dirk Van Essendelft and presented at the supercomputing conference SC20 this week. The team said the CS-1 completed a simulation of combustion in a power plant roughly 200 times faster than it took the Joule 2.0 supercomputer to do a similar task.
The CS-1 was actually faster-than-real-time. As Cerebrus wrote in a blog post, "It can tell you what is going to happen in the future faster than the laws of physics produce the same result."
The researchers said the CS-1's performance couldn't be matched by any number of CPUs and GPUs. And CEO and cofounder Andrew Feldman told VentureBeat that would be true "no matter how large the supercomputer is." At a point, scaling a supercomputer like Joule no longer produces better results in this kind of problem. That's why Joule's simulation speed peaked at 16,384 cores, a fraction of its total 86,400 cores.
Previously:
Cerebras More than Doubles Core and Transistor Count with 2nd-Generation Wafer Scale Engine
Cerebras Systems' Wafer Scale Engine Deployed at Argonne National Labs
Cerebras "Wafer Scale Engine" Has 1.2 Trillion Transistors, 400,000 Cores
(Score: 0) by Anonymous Coward on Monday November 23 2020, @09:57PM (3 children)
They will stack two of these with solder dots (or some other connector technology). Chiller capacity & power supply will have to roughly double, but otherwise it's a plug for plug replacement for the single wafer version.
(Score: 2) by takyon on Monday November 23 2020, @10:14PM (2 children)
TSMC Will Manufacture 3D Stacked WoW Chips In 2021 Claims Executive [wccftech.com]
Whole wafer on whole wafer (WWoWW)?
[SIG] 10/28/2017: Soylent Upgrade v14 [soylentnews.org]
(Score: 2) by hendrikboom on Monday November 23 2020, @11:32PM (1 child)
Hmmm. How *would* one design a Word of Warfare chip? What would it do?
(Score: 2) by takyon on Monday November 23 2020, @11:43PM
In a world: kill.
WoW (wafer on wafer) could be a crude way to double performance by stacking two wafers. Heat issues could limit the applications. We should know more within a year.
[SIG] 10/28/2017: Soylent Upgrade v14 [soylentnews.org]