SoylentNews is people
SoylentNews
CAMM = Compression Attached Memory Module
CAMM to Usurp SO-DIMM Laptop Memory Form Factor Says JEDEC Member
So, farewell, SO-DIMM. After a quarter century of service in laptop, all-in-ones and other compact designs, it looks like the end of the road for SO-DIMM is in sight. JEDEC committee member and Dell Senior Distinguished Engineer, Tom Schnell, told PC World that the new 'CAMM Common Spec' will be the next RAM standard for laptops. There already seems to have been a lot of progress in the background, with the v0.5 spec already approved by 20 or so companies in the task group, and JEDEC expected to finalize the v1.0 spec in the second half of this year.
[...] The new information from PC World editor Gordon Ung's chat with Tom Schnell helps us weigh up some of the pros and cons of CAMM, and point to some ways it has progressed from Dell's pre-JEDEC-approved spec. Apparently, as well as improved density (more RAM capacity in a smaller space), CAMM is amenable to "scaling to ever higher clock speeds." Specifically, the new information indicates that the DDR5-6400 'brick wall' for SO-DIMMs will be shrugged off by CAMMs.
When CAMM reaches devices, there are a couple of tech advances which could help spur its adoption. We mentioned the faster DDR5 speeds above, but it is thought that CAMM could really take off when DDR6 arrives. Another appealing variation might be for adding LPDDR(6) memory to laptops. Traditionally LPDDR memory is soldered, so the new spring contact fitting modules might mean much better upgradability for the thinnest and lightest devices which tend to use LPDDR memory.
Previously: Dell Defends its Controversial New Laptop Memory (CAMM)
(Score: 3, Interesting) by Immerman on Thursday January 19, @04:15PM (1 child)
I think the capacity ceiling basically comes down to how many memory chips can fit in a given area (and volume). SO-DIMM only has room (and connectors) for a single row of chips per side on a stick of RAM (2 with some smaller chips), so getting a comparable number of memory chips requires at *least* 2 sticks of RAM, 2 socket connectors, and a whole lot of space either vertically or horizontally.
Combine that with the fact that SO-DIMM required clearance dimensions were established 20+ years ago when manufacturing scales were considerably larger... and there's just a whole lot of wasted space (both airspace and board-space) that makes soldered-on RAM much more attractive for compact devices.
CAMM replaces that with a single large plate where the RAM chips can be packed in as densely as the wiring allows, while requiring less than half the height clearance of a single SO-DIMM socket.
If I counted right, it also looks like CAMM has 660 pins compared to the 200 to 262 pins of DDR SO-DIMM (depending on generation). Which probably means both a few more address lines (every additional line doubles the size of the address space), and that even at the same signalling speed data can be transferred almost three times as fast as to a single SO-DIMM stick.
Fun fact - I've also heard that there's going to be different sizes of CAMM modules. e.g. a 128GB module is going to require a much larger circuit board than a 32GB module, and won't be compatible with e.g. a laptop that only has room for the smaller modules. At least until the technology miniaturizes enough to squeeze 128GB onto the smaller board size.
(Score: 3, Interesting) by takyon on Thursday January 19, @04:55PM
My comment above has an image of several sizes.
It could be similar to M.2 SSDs. M.2 2280 (22mm x 80mm) is common in today's desktops, but the Steam Deck can only take an M.2 2242. I believe the Steam Deck breathed new life into that option with some new, tiny 1 TB models being announced. Then you have 25110 coming:
https://soylentnews.org/comments.pl?cid=1275741&sid=51872 [soylentnews.org]
[SIG] 10/28/2017: Soylent Upgrade v14 [soylentnews.org]