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posted by janrinok on Wednesday January 18, @05:24PM   Printer-friendly
from the CAMM-do-attitude dept.

CAMM = Compression Attached Memory Module

CAMM to Usurp SO-DIMM Laptop Memory Form Factor Says JEDEC Member

So, farewell, SO-DIMM. After a quarter century of service in laptop, all-in-ones and other compact designs, it looks like the end of the road for SO-DIMM is in sight. JEDEC committee member and Dell Senior Distinguished Engineer, Tom Schnell, told PC World that the new 'CAMM Common Spec' will be the next RAM standard for laptops. There already seems to have been a lot of progress in the background, with the v0.5 spec already approved by 20 or so companies in the task group, and JEDEC expected to finalize the v1.0 spec in the second half of this year.

[...] The new information from PC World editor Gordon Ung's chat with Tom Schnell helps us weigh up some of the pros and cons of CAMM, and point to some ways it has progressed from Dell's pre-JEDEC-approved spec. Apparently, as well as improved density (more RAM capacity in a smaller space), CAMM is amenable to "scaling to ever higher clock speeds." Specifically, the new information indicates that the DDR5-6400 'brick wall' for SO-DIMMs will be shrugged off by CAMMs.

When CAMM reaches devices, there are a couple of tech advances which could help spur its adoption. We mentioned the faster DDR5 speeds above, but it is thought that CAMM could really take off when DDR6 arrives. Another appealing variation might be for adding LPDDR(6) memory to laptops. Traditionally LPDDR memory is soldered, so the new spring contact fitting modules might mean much better upgradability for the thinnest and lightest devices which tend to use LPDDR memory.

DIMM, memory module.

Previously: Dell Defends its Controversial New Laptop Memory (CAMM)


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  • (Score: 2) by bzipitidoo on Friday January 20, @04:25AM

    by bzipitidoo (4388) Subscriber Badge on Friday January 20, @04:25AM (#1287682) Journal

    I have always found it baffling that transistors are packed as tightly as possible on chips, and then, positioned on a circuit board so that the travel distance between chips is many orders of magnitude greater than within. I get that it helps dissipate heat, and reduces the defect rate by keeping down the number of transistors on a die, but seems the circuit board has been some seriously low hanging fruit for improvements for a good while now. Perhaps System on a Chip is the answer?

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