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Title    Intel Announces Core H Laptop Chips With AMD Graphics and High Bandwidth Memory
Date    Tuesday November 07 2017, @04:34AM
Author    takyon
Topic   
from the AMD-Inside™ dept.
https://soylentnews.org/article.pl?sid=17/11/07/0224257

Intel squeezed an AMD graphics chip, RAM and CPU into one module

the new processor integrates a "semi-custom" AMD graphics chip and the second generation of Intel's "High Bandwidth Memory (HBM2)", which is comparable to GDDR5 in a traditional laptop.

Intel CPU and AMD GPU, together at last

richtopia writes:

Summary of Intel's news:

The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD's Radeon Technologies Group* – all in a single processor package.

[...] At the heart of this new design is EMIB (Embedded Multi-Die Interconnect Bridge), a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.

[...] Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.

takyon: This is more like an "integrated discrete GPU" than standard integrated graphics. It also avoids the need for Intel to license AMD's IP. AMD also needs to make a lot of parts since its wafer supply agreement with GlobalFoundries penalizes AMD if they buy less than a target number of wafers each year.

Also at AnandTech and Ars Technica.

Previously: AMD Stock Surges on Report of Intel Graphics Licensing Deal, 16-Core Ryzen Confirmed

Related: Samsung Increases Production of 8 GB High Bandwidth Memory 2.0 Stacks


Original Submission #1Original Submission #2

Links

  1. "Intel squeezed an AMD graphics chip, RAM and CPU into one module" - https://www.engadget.com/2017/11/06/intel-core-h-8th-gen/
  2. "richtopia" - https://soylentnews.org/~richtopia/
  3. "Intel's news" - https://newsroom.intel.com/editorials/new-intel-core-processor-combine-high-performance-cpu-discrete-graphics-sleek-thin-devices/?cid=em-elq-31838&utm_source=elq&utm_medium=email&utm_campaign=31838&elq_cid=1495015
  4. "wafer supply agreement with GlobalFoundries penalizes AMD" - https://www.anandtech.com/show/10631/amd-amends-globalfoundries-wafer-supply-agreement-through-2020
  5. "AnandTech" - https://www.anandtech.com/show/12003/intel-to-create-new-8th-generation-cpus-with-amd-radeon-graphics-with-hbm2-using-emib
  6. "Ars Technica" - https://arstechnica.com/gadgets/2017/11/intel-will-ship-processors-with-integrated-amd-graphics-and-memory/
  7. "AMD Stock Surges on Report of Intel Graphics Licensing Deal, 16-Core Ryzen Confirmed" - https://soylentnews.org/article.pl?sid=17/05/17/2236202
  8. "Samsung Increases Production of 8 GB High Bandwidth Memory 2.0 Stacks" - https://soylentnews.org/article.pl?sid=17/07/20/0154228
  9. "Original Submission #1" - https://soylentnews.org/submit.pl?op=viewsub&subid=23195
  10. "Original Submission #2" - https://soylentnews.org/submit.pl?op=viewsub&subid=23196

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