| Title | SK Hynix Announces HBM2E Memory for 2020 Release | |
| Date | Monday August 12 2019, @11:32PM | |
| Author | martyb | |
| Topic | ||
| from the more,-faster,-soon dept. | ||
[HBM is High Bandwidth Memory. -Ed.]
SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators
SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn't using any kind of flash name for the memory (ala Samsung's Flashbolt), the idea is the same: releasing faster and higher density HBM2 memory for the next generation of high-end processors. Hynix's HBM2E memory will reach up to 3.6 Gbps, which as things currently stand, will make it the fastest HBM2E memory on the market when it ships in 2020.
As a quick refresher, HBM2E is a small update to the HBM2 standard to improve its performance, serving as a mid-generational kicker of sorts to allow for higher clockspeeds, higher densities (up to 24GB with 12 layers), and the underlying changes that are required to make those happen. Samsung was the first memory vendor to announce HBM2E memory earlier this year, with their 16GB/stack Flashbolt memory, which runs at up to 3.2 Gbps. At the time, Samsung did not announce a release date, and to the best of our knowledge, mass production still hasn't begun.
[...] [SK Hynix's] capacity is doubling, from 8 Gb/layer to 16 Gb/layer, allowing a full 8-Hi stack to reach a total of 16GB. It's worth noting that the revised HBM2 standard actually allows for 12-Hi stacks, for a total of 24GB/stack, however we've yet to see anyone announce memory quite that dense.
See also: HBM2E: The E Stands For Evolutionary
Previously: JEDEC Updates High Bandwidth Memory Standard With New 12-Hi Stacks
Samsung Announces "Flashbolt" HBM2E (High Bandwidth Memory) DRAM packages
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printed from SoylentNews, SK Hynix Announces HBM2E Memory for 2020 Release on 2024-04-25 10:27:11