At its CES keynote today, Intel demonstrated ODM systems from Pegatron and Wistron, and Dell even joined Intel on stage to show off an Ice Lake-powered XPS laptop that will be available later this year. Dell didn’t show the device powered on, but it appeared to be a 2-in-1 device that looked similar to the XPS 13.
Intel is also looking to the future, too. The chip giant is planning to use Foveros 3D chip stacking technology to build future chips, a method that allows Intel’s chip designers to stack extra processing power on top of an already-assembled chip die. These “chiplets” can be stacked atop one another to form a processor that includes graphics, AI processing, and more.