ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming [anandtech.com]
ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography tools is rising and semiconductors manufacturers are building new fabs. In addition, ASML indicated plans to introduce a new EUV scanner that will offer a higher production throughput, the NXE: 3400C.
Last year ASML shipped (only) 18 Twinscan NXE: 3400B EUV scanners. This was slightly below its expectations, to supply 20 machines. In total, as of July 2018, there were 31 EUV scanners installed at various fabs across the world, including several machines in various semiconductor research organizations, including imec. If everything goes as planned, ASML will ship more extreme ultraviolet scanners in 2019 than it did in in years before that.
[...] Samsung Foundry has already started to use ASML's EUV equipment for production of commercial chips using its 7LPP [anandtech.com] process technology at its Fab S3.
[...] TSMC is set to start using its Twinscan NXE scanners for commercial wafers in the second half of this year to produce chips using its N7+ manufacturing technology. Initially EUV scanners will be used for non-critical layers, but their use will be expanded at the 5 nm node [anandtech.com] in 2020 – 2021.
[...] Demand for ASML's Twinscan NXE tools will be further boosted by demand from Intel and SK Hynix.
Previously: ASML Says Fire at Supplier Prodrive Will Lead to Delays Early Next Year [soylentnews.org]
Related: TSMC Details Scaling/Performance Gains Expected From "5nm CLN5" Process [soylentnews.org]