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SK Hynix will begin mass production of 4 GB HBM2 memory stacks soon:
SK Hynix has quietly added its HBM Gen 2 memory stacks to its public product catalog earlier this month, which means that the start of mass production should be imminent. The company will first offer two types of new memory modules with the same capacity, but different transfer-rates, targeting graphics cards, HPC accelerators and other applications. Over time, the HBM2 family will get broader.
SK Hynix intends to initially offer its clients 4 GB HBM2 4Hi stack KGSDs (known good stack dies) based on 8 Gb DRAM devices. The memory devices will feature a 1024-bit bus as well as 1.6 GT/s (H5VR32ESM4H-12C) and 2.0 GT/s (H5VR32ESM4H-20C) data-rates, thus offering 204 GB/s and 256 GB/s peak bandwidth per stack.
Samsung has already manufactured 4 GB stacks. Eventually, there will also be 2 GB and 8 GB stacks available.
Previously: AMD Shares More Details on High Bandwidth Memory
Samsung Announces Mass Production of HBM2 DRAM
(Score: 0) by Anonymous Coward on Tuesday August 02 2016, @04:10PM
Most sticks of system ram use 128 lines because they are 64 bits and two channels. Newer processors can use up to 256 lines because they have four channels. Most new GPUs use 512 lines or more because they use even more channels to increase bandwidth. Some even used 32 bit internally but even more channels, as bandwidth was more important than bit depth. Here, they use the same number of channels as most modern GPUs, but each channel is 128 bits wide.