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posted by hubie on Sunday November 19, @06:24PM   Printer-friendly

AMD Readies 8-Core Ryzen 7 5700X3D and 6-Core Ryzen 5 5500X3D With 96MB L3 Cache:

As per information from chi11eddog, a reliable source for hardware leaks regarding CPU and motherboard launches, AMD is reportedly in the process of developing at least two additional CPUs in the Ryzen 5000X3D series. One of these is a more affordable 8-core model known as the Ryzen 7 5700X3D, anticipated to boast a base clock of 3.0 GHz and a boost clock of 4.1 GHz. This particular CPU is expected to have clock speeds that are 400 MHz lower than the 5800X3D SKU.

[...] The current report does not offer details on the potential availability of the newly discussed CPUs. Right now, AMD has two new CPUs with 3D V-Cache. One is called the 5800X3D and is considered the best gaming CPU for the AM4 platform. The other is called the 5600X3D and can only be bought from MicroCenter in the United States. The prospect of AMD broadening the availability of 3D V-Cache options globally, rather than confining them to specific retailers, would indeed be noteworthy.

The introduction of the 5700X3D and 5500X3D models for the AM4 platform could make it better for gamers who don't want to spend too much money. The release of more cost-effective SKUs could offer gamers an attractive upgrade path without imposing a substantial financial burden, paving the way for a transition to newer AM5/LGA-1851 sockets in the future.

A noteworthy aspect of the X3D series is its compatibility with various entry-level motherboards. These CPUs do not support overclocking. Hence, their requirements are lower. Despite this limitation, these CPUs show superior performance in gaming tests compared to their non-X3D counterparts.

Source: @g01d3nm4ng0

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  • (Score: 4, Insightful) by takyon on Sunday November 19, @07:17PM

    by takyon (881) <> on Sunday November 19, @07:17PM (#1333531) Journal

    5600X3D was a supposedly limited run Micro Center exclusive, now here come two more models, supposedly.

    AMD could be stockpiling the necessary low-grade chiplets from Epyc Milan or Milan-X (3D V-Cache version) production, which could continue for years to satisfy those customers.

    Even the 5500X3D would be a good upgrade for users of older AM4 CPUs, especially pre-Zen 2. As long as the price is low. Throwing more CPUs onto the market while motherboard makers move on should help with that.

    The AM4 socket's biggest problem is the lack of integrated graphics on the regular desktop CPUs (non-APUs). That's solved on AM5, where every model except the 7500F so far has an iGPU. With an iGPU, the chip remains useful by itself for a wide variety of use cases and form factors indefinitely.

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  • (Score: 4, Interesting) by crafoo on Sunday November 19, @11:37PM (1 child)

    by crafoo (6639) on Sunday November 19, @11:37PM (#1333557)

    I don't know much of anything about chip fabs and didn't know what X3D is. Asianometry channel on youtube has a decent intro in the context of the nvidia AI accelerator hardware. The silicon vias looked very interesting and difficult to fabricate reliably. I found this article: []

    anyone with good articles or videos from fluent English speakers?

    • (Score: 5, Informative) by takyon on Monday November 20, @02:29AM

      by takyon (881) <> on Monday November 20, @02:29AM (#1333568) Journal [] [] []

      Simply put, it's a packaging technique TSMC developed that AMD has branded "X3D" or "3D V-Cache". It allows a cache chiplet to be vertically stacked and bonded to an underlying compute chiplet.

      AMD has used 64 MiB cache chiplets to date, on top of the usual 32 MiB in the core complex die (CCD) for a total of 96 MiB that a single core on that die can access. The cache chiplets consist of a single layer, although in theory they could contain multiple layers, much like High Bandwidth Memory (HBM) chips. There is also inert "structural silicon" added around the cache chiplet.

      Someone, somewhere discovered that the previous generation Zen 2 desktop CPUs (e.g. Ryzen 7 3800X) have the microscopic TSV connector pads(?) necessary to connect cache chiplets, but the technique wasn't mature enough at the time, so they went unused. Even with Zen 3, the 5800X3D launched over a year after the first chips in the family (November 5, 2020 to April 20, 2022). The lag time for X3D launches points to it being difficult to get right. Now AMD is dumping accumulated low quality X3D chips onto the market, although it's hard to say how much. There may have only been low thousands of 5600X3D CPUs distributed to Micro Center, a single U.S. retailer. That's what makes news rumors of a 5500X3D and 5700X3D a little weird.

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