BeaverCleaver [soylentnews.org] writes:
Engineers at the Georgia Institute of technology have demonstrated that piles of silicon dioxide particles coated with ethylene glycol can conduct heat much more effectively that plain silicon dioxide or ethylene glycol. This could have benefits for a range of electronic devices - light, cheap heatsinks that do not also conduct electricity have many benefits. The present experimental nano particles already show thermal properties similar to expensive polymer heat-transfer compounds, although more work needs to be done to find a more stable coating than ethylene glycol. (Which itself has a long history in thermal management, being a primary component of antifreeze)
http://m.phys.org/news/2016-07-sand-cool-electronic-devices.html [phys.org] has the details.
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