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takyon [soylentnews.org] writes:

China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb [anandtech.com]

Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its Xtacking architecture which enables it to run with super high I/O while maximising the density of its memory arrays. YMTC has also unveiled its plan for a 128-layer 512 Gb TLC chip, the X2-9060, designed to meet more diverse application requirements.

[...] The QLC based X2-6070 has 128-layers and more than 366 billion effective charge-trap memory cells. Each memory cell has 4-bit of data, which equates to 1.33 Tb of storage capacity. Everything is proportionate to cost, and it seems like YMTC, which is newer than most to 3D NAND stacking, could again improve its Xtacking architecture in the future.

Xtacking [anandtech.com] is not a typo.

Related: Western Digital Samples 96-Layer 3D QLC NAND with 1.33 Tb Per Die [soylentnews.org]
'Unstoppable' Chinese NAND fabber YMTC to unleash 64-layer flash flood before skipping ahead to 128 – analyst [theregister.co.uk]
SK Hynix Finishes 128-Layer 3D NAND, Plans 176-Layer 3D NAND [soylentnews.org]
Report: China-Based Yangtze Memory Starts 64-Layer NAND Production [tomshardware.com]
YMTC Starts Volume Production of 64-Layer 3D NAND [anandtech.com]

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