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takyon [soylentnews.org] writes:

TSMC to Spend $100B on Fabs and R&D Over Next Three Years: 2nm, Arizona Fab & More [anandtech.com]

TSMC this week has announced plans to spend $100 billion on new production facilities as well as R&D over the next three years. The world's largest contract maker of chips says that its fabs are currently working at full load, so to meet demand for its services going forward it will need (much) more capacity. Among TSMC's facilities to go online in the next three to four years are the company's fab in Arizona as well as its first 2nm-capable fab in Taiwan.

[...] TSMC's capital expenditures (CapEx) budget last year [tsmc.com] was $17.2 billion, whereas its R&D budget was $3.72 billion, or approximately 8.2% of its revenue. This year the company intends to increase its CapEx to somewhere in the range of $25 to $28 billion, which would make for a 45% to 62% year-over-year increase in that spending. The company's R&D spending will also rise as its revenue is expected to grow. In total, TSMC plans to invest around $30 billion or more on CapEx and R&D this year. Taken altogether, if the company intends to spend around $100 billion from 2021 through 2023, its expenditures in the next two years will be roughly flat with 2021, something that should please its investors.

SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month [anandtech.com]

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab complex. The fab cluster will be primarily used to build DRAM for PCs, mobile devices, and servers, using process technologies that rely on extreme ultraviolet lithography (EUV). The first fab in the complex will go online in 2025.

[...] The new fabs will be used to make various types of DRAM using SK Hynix's upcoming production technologies that will use extreme ultraviolet (EUV) lithography. And with a start date still years away, we're likely looking at a fab that will be used to manufacture DDR5, LPDDR5X, and other future types of DRAM.

See also: TSMC bumps spending up 50% to meet increased demand [arstechnica.com]

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