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takyon [soylentnews.org] writes:

TSMC Reportedly Mulls Advanced Chip Packaging Facility in Arizona [tomshardware.com]

TSMC is in talks with Arizona officials to build its chip packaging facility in the state, Katie Hobbs, governor of Arizona, said in Taipei after visiting the world's No.1 foundry's headquarters, reports Bloomberg [bloomberg.com]. If the plan comes to fruition, then TSMC's will have a vertically integrated chip production chain in the USA for the first time ever.

TSMC has built Fab 21 in Arizona and is currently installing production tools there. The company is also building up the second phase of the fab and has approved plans to invest $40 billion in these two production facilities. But the company apparently does not want to stop there and is discussing the possibility of building an advanced packaging fab in the state, too, as this will help it to assemble complex system-in-packages for its clients from the U.S. on American soil.

Previously: Apple Chips Made In The US Still Require Assembly In Taiwan, Report Suggests [soylentnews.org]

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