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Phoenix666 [soylentnews.org] writes:

Cooling fans and other system-level solutions are reaching their limits as circuit densities continue to grow. It’s no wonder then that graphene’s remarkable heat conductivity has led to a lot of research into using it to for thermal management in electronics [ieee.org].
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In research published in the journal Nature Communications, the scientists demonstrated that the electrostatic interactions between electrically charged particles—known as Coulomb interactions—in different layers of multi-layered graphene offers a key mechanism for dispersing heat. This occurs despite the fact that all electronic states are strongly confined within individual 2D layers.
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When the negative charges repel each other, the electrons take on an effective size that extends between the layers. When the electrons come in contact with each other in this way, the hotter electrons transfer heat to the colder ones. This transfer of heat eventually channels down through the graphene towards the layer that is closest to the silicon carbide substrate the researchers used in these experiments. Once it gets to the final layer of graphene, the heat transfers into the silicon carbide.

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