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posted by martyb on Tuesday January 02 2018, @04:27PM   Printer-friendly
from the progress++ dept.

An Intel website leaked some details of the Intel Core i7-8809G, a "Kaby Lake" desktop CPU with on-package AMD Radeon graphics and High Bandwidth Memory 2.0. While it is listed as an 8th-generation part, 8th-generation "Coffee Lake" CPUs for desktop users have up to 6 cores (in other words, Intel has been releasing multiple microarchitectures as "8th-generation"). The i7-8809G may be officially announced at the Consumer Electronics Show next week.

The components are linked together using what Intel calls "embedded multi-die interconnect bridge technology" (EMIB). The thermal design power (TDP) of the entire package is around 100 Watts:

Intel at the original launch did state that they were using Core-H grade CPUs for the Intel with Radeon Graphics products, which would mean that the CPU portion is around 45W. This would lead to ~55W left for graphics, which would be in the RX 550 level: 8 CUs, 512 SPs, running at 1100 MHz. It is worth nothing that AMD already puts up to 10 Vega CUs in its 15W processors, so with the Intel i7-8809G product Intel has likely has gone wider and slower: judging by the size of the silicon in the mockup, this could be more of a 20-24 CU design built within that 55W-75W window, depending on how the power budget is moved around between CPU and GPU. We await more information, of course.

It is rumored to include 4 GB of HBM2 on-package, while the CPU also supports DDR4-2400 memory. Two cheaper EMIB CPUs have been mentioned:

According to some other media, the 8809G will turbo to 4.1 GHz, while the graphics will feature 24 [compute units (CUs)] (1536 [stream processors (SPs)]) running at 1190 MHz while the HBM2 is 4GB and will run at 800 MHz. The same media are also listing the Core i7-8705G (20 CUs, 1000 MHz on 'Vega M GL', 700 MHz on HBM2) and a Core i7-8706G. None of the information from those sources is yet to be verified by AnandTech or found on an official Intel webpage.

Currently available AMD Ryzen Mobile APUs only include 8-10 Vega CUs. These are mobile chips with a maximum TDP of 25 W; no desktop Ryzen chips with integrated graphics have been announced yet.

Previously: Intel Announces Core H Laptop Chips With AMD Graphics and High Bandwidth Memory


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  • (Score: 3, Informative) by takyon on Tuesday January 02 2018, @10:45PM

    by takyon (881) <{takyon} {at} {soylentnews.org}> on Tuesday January 02 2018, @10:45PM (#616942) Journal

    The combination of an on-package GPU and the High Bandwidth Memory may have some advantages over discrete GPUs. Moving everything closer together helps overcome certain limits:

    http://www.nersc.gov/users/computational-systems/cori/application-porting-and-performance/using-on-package-memory/ [nersc.gov]

    Some users want smaller form factors, for Home Theater PCs (HTPCs) for example. This kind of on-package stuff might be cheaper than using a discrete GPU, with lower power consumption, but with better performance than integrated graphics. It might be worth it.

    Also, I was not sure when writing the summary, but I think both the Intel integrated graphics and AMD Radeon Vega graphics may be included on these chips. In which case you might have a setup well suited to newer graphics APIs like Vulkan which can take advantage of these disparate assets.

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