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takyon [soylentnews.org] writes:

Hot Chips 2020: Marvell Details ThunderX3 CPUs - Up to 60 Cores Per Die, 96 Dual-Die in 2021 [anandtech.com]

Today as part of HotChips 2020 we saw Marvell finally reveal some details on the microarchitecture of their new ThunderX3 server CPUs and core microarchitectures. The company had announced the existence of the new server and infrastructure processor back in March [anandtech.com], and is now able to share more concrete specifications about how the in-house CPU design team promises to distinguish itself from the quickly growing competition that is the Arm server market.

[...] Marvell started off the HotChips presentation with a roadmap of its products, detailing that the ThunderX3 generation isn't merely just a single design, but actually represents a flexible approach using multiple dies, with the first generation 60-core CN110xx SKUs using a single die as a monolithic design in 2020, and next year seeing the release of a 96-core dual-die variant aiming for higher performance.

The use of a dual-die approach like this is very interesting as it represents a mid-point between a completely monolithic design, and a chiplet approach from vendors such as AMD. Each die here is identical in the sense that it can be used independently as standalone products.

Some details about the CPUs and the 4-way SMT were given in the presentation. TDPs will range from 100 Watts to 240 Watts.

Previously: Marvell Announces ThunderX3, an ARM Server CPU With 96 Cores, 384 Threads [soylentnews.org]

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