In response to increased demand, Samsung is increasing production [anandtech.com] of the densest HBM2 DRAM available:
Samsung on Tuesday announced that it is increasing production volumes of its 8 GB, 8-Hi HBM2 DRAM stacks due to growing demand. In the coming months the company's 8 GB HBM2 chips will be used for several applications, including those for consumers, professionals, AI, as well as for parallel computing. Meanwhile, AMD's Radeon Vega graphics cards for professionals and gamers will likely be the largest consumers of HBM2 in terms of volume. And while AMD is traditionally a SK Hynix customer, the timing of this announcement with AMD's launches certainly suggests that AMD is likely a Samsung customer this round as well.
Samsung's 8 GB HBM Gen 2 memory KGSDs (known good stacked die) are based on eight 8-Gb DRAM devices in an 8-Hi stack configuration. The memory components are interconnected using TSVs and feature over 5,000 TSV interconnects each. Every KGSD has a 1024-bit bus and offers up to 2 Gbps data rate per pin, thus providing up to 256 GB/s of memory bandwidth per single 8-Hi stack. The company did not disclose power consumption and heat dissipation of its HBM memory components, but we have reached out Samsung for additional details.