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takyon [soylentnews.org] writes:

Intel Lakefield SoC With Foveros 3D Packaging Previewed – 10nm Hybrid CPU Architecture Featuring Sunny Cove, Gen 11 Graphics and More [wccftech.com]

Intel Lakefield is based around Foveros technology [wccftech.com] which helps connect chips and chiplets in a single package that matches the functionality and performance of a monolithic SOC. Each die is then stacked using FTF micro-bumps on the active interposer through which TSVs are drilled to connect with solder bumps and eventually the final package. The whole SOC is just 12×12 (mm) which is 144mm².

Talking about the SOC itself and its individual layers, the Lakefield SOC that has been previewed consists of at least four layers or dies, each serving a different purpose. The top two layers are composed of the DRAM which will supplement the processor as the main system memory. This is done through the PoP (Package on Package) memory layout which stacks two BGA DRAMs on top of each other as illustrated in the preview video. The SOC won't have to rely on socketed DRAM in this case which saves a lot of footprint on the main board.

The second layer is the Compute Chiplet with a Hybrid CPU architecture and graphics, based on the 10nm process node. The Hybrid CPU architecture has a total of five individual Cores, one of them is labeled as the Big Core which features the Sunny Cove architecture. That's the same CPU architecture that will be featured on Intel's upcoming 10nm Ice Lake processors. The Sunny Cove Core is optimized for high-performance throughput. There are also four small CPUs that are based on the 10nm process but optimized for power efficiency. The same die [has] Intel's Gen 11 graphics engine with 64 Execution Units.

[...] [Last] of all is the base die which serves as the cache and I/O block of the SOC. Labeled as the P1222 and based on a 22FFL process node, the base die comes with a low cost and low leakage design while providing a feature-rich array of I/O capabilities.

It would be nice to finally see some consumer CPUs with stacked DRAM, although the amount was not specified (8 GB?).

Intel video [youtube.com] (1m48s). Also at Notebookcheck [notebookcheck.net].

Previously: Intel Announces "Sunny Cove", Gen11 Graphics, Discrete Graphics Brand Name, 3D Packaging, and More [soylentnews.org]
Intel Promises "10nm" Chips by the End of 2019, and More [soylentnews.org]

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