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takyon [soylentnews.org] writes:

Samsung recently announced its fourth generation of 3D/vertical NAND [soylentnews.org], with 64 layers and a capacity of 512Gb (64GB) per die. Now SK Hynix is announcing its plans for 512 Gb V-NAND dies with 72 layers [anandtech.com]:

Later this year SK Hynix intends to start volume production of 72-layer 3D TLC NAND (3D-V4) memory and this is where things start to get interesting. Initially, SK Hynix intends to produce 256 Gb 3D TLC ICs and these are going to be available already in Q2 2017, according to the company's product catalog. Later on, sometimes in Q4, the company plans to introduce 512 Gb 3D TLC ICs (64 GB), which will help it to significantly increase capacities of SSDs and other devices featuring NAND flash.

What is important about SK Hynix's fourth-gen 3D NAND is that it will feature block size of 13.5 MB, which will increase the performance of such ICs compared to 3D-V3 and 3D-V2 that have a block size of 9 MB. At this point, we do not know whether SK Hynix intends to increase interface speed of its 512 Gb 3D-V4 ICs to compensate lower parallelism in lower-capacity SSDs, like Samsung did with its high-capacity 64-layer 3D V-NAND chips. What we do know is that SK Hynix's catalog already includes NAND multi-chip packages of 8192 Gb capacity (1 TB) that will enable high-capacity SSDs in smaller form-factors (e.g., [2 TB] single-sided M.2). Meanwhile, 64 GB NAND flash chips may force SK Hynix and its partners to abandon low-capacity SSDs (i.e., 120/128 GB) unless there is sufficient demand.

The article also talks about the company's plans for 18nm DRAM and fabrication facility expansion.

Related: Toshiba and SanDisk Announce 48-Layer 256 Gb 3D NAND [soylentnews.org]
Toshiba Teasing QLC 3D NAND and TSV for More Layers [soylentnews.org]

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